Things To Take Care Of For Network Testing, Self-Driving Electric Vehicle For Delivery, World’s Top 30 Electrical Engineering Project Ideas, 9 Free And Open Source Software For Circuit Designing, Technology For High-Performing And Complex AI Electronics, Job: Graduate & Technician Apprentices At BDL, JOB: IT Analyst/Developer C# At Sherwin Williams, New IC Reduces Volume of AC-DC Converters By Up To 40 Per Cent, Unique Prototyping Platform Integrates Microelectronics and Fluid Handling, Open-Source Industrial SBC Powered By ARM Cortex-A5 SoC, Solving Water Crisis With Air And Nanotechnology, Design Your Own Electric Vehicle Battery Charging Solutions. After SOIC came a family of smaller form factors with pin spacings less than 1.27 mm: Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.0256 inches (0.65 mm) or 0.025 inches (0.635 mm). These are sometimes called "wide SOIC," as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called "wide SOIC.". The SOIC is more than 50% longer than the TSSOP.

Jul 25, 2019 #1 Seems pretty much the same size. Screw Shield for Mega/Due/Uno,  Bobuino with ATMega1284P, & other '328P & '1284P creations & offerings at  my website., Phi_prompt, phi_interfaces, phi-2 shields, phi-panels. There are many types of IC packages, each having unique dimensions, mounting types and/or pin counts. Is there a difference between SOIC and SOP? You must manually step through all relevant dimensions. Lower height? The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.

There seems to be a difference to the thickness but other than that looks like it would fit on the same pads. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high frequency applications. It only takes a minute to sign up. provides. That may not seem like a lot to you, but on a crowded board it might make a difference.

So besides TI, do other manufactures also have different SOP and SOIC foot prints? Usually special automated tools are used to solder these on PCBs.,,, A thin-shrink small-outline package (TSSOP) is a rectangular, thin body size component. The official names are the SOT-xxxx ones IIRC. Some manufacturers offer the same part in both 0.15 and 0.3 inch packages - MAX232 springs to mind, 0.15 and 0.3 inch.

Each package has multiple names in general. Thanks guys! May 3, 2016 #2 It sounds like you didn't notice that the pinout for the two packages is different(?). Algorithm for Apple IIe and Apple IIgs boot/start beep. The pins on a DIP IC are spaced 2.54mm apart, which is a standard spacing—perfect for fitting into breadboards, veroboards and other prototyping boards. Designing & building electrical circuits for over 25 years. Is it a good idea to shove your arm down a werewolf's throat if you only want to incapacitate them? But the footprint looks like SOIC. On SOIC packages, each pin is usually spaced by about 0.05" (1.27mm) from the next. Network Consists of Further Focused Websites (Channels).
Many electronic retailers will list parts in either package as SOIC whether they are referring to the JEDEC or JEITA/EIAJ standards.
So confused... can I drop in replace one for the other?

Suggestions for braking with severe osteoarthritis in both hands. The official names are the SOT-xxxx ones IIRC. So besides TI, do other manufactures also have different SOP and SOIC foot prints? Linear aproximation of an inductor in a switch circuit. A platform for tech faculty and institutions, Enabling commerce between buyers & sellers of electronics in India, Everything you want to know about India's electronics industry, Enabling you to benefit from investments in technology, New-Generation Automotive Electronics, Infotronics and Skilled Workforce.

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following 8-pin packages: •SOIC •DIP •MSOP • TSSOP Career advice and jobs related to electronics and IOT.

Scroll to continue with content. So it shouldn’t be too hard to adjust on runs. Joined Jan 21, 2019 1,748.

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Advanced ICs are available in BGA packages. How can I get rid of common areas in this plot? Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart. I have been looking at the pins of the HC595 in SOIC-16 and SO-16 formats. These dimensions differ depending on the SOIC in question, and there are several variants. hp1729. Is the nucleus smaller than the electron? TSSOP is Thin SSOP. Small-Outline (SOP) Small-outline IC (SOIC) packages are the surface-mount cousin of the DIP. is there a standard name for surface-mounted 0.1" pitch DIP packages? This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 in (1.27 mm). Why the SOP? Now with Unlimited Eagle board sizes. Quad-flat package (QFP) Unlike DIP having two sides, QFP IC has pins on all four sides. What is a proper way to support/suspend cat6 cable in a drop ceiling? whats the difference bet SOIC-8 and SO-8 Package?Can I use SO-8 Package in place of SOIC-8 packege in layout ?

SMD IC packages usually need custom PCBs, containing a matching pattern of copper on which they are to be soldered. Electrical Engineering Stack Exchange is a question and answer site for electronics and electrical engineering professionals, students, and enthusiasts. The values of these dimensions (in mm) for common SOICs is shown in the table. The SOIC package is shorter and narrower than DIPs, the side-to-side pitch being 6 mm for an SOIC-14 (from lead tip to lead tip) and the body width being 3.9 mm. The picture below shows the general shape of a SOIC narrow package, with major dimensions. Image of a 74HC4067 multiplexer chip in a SSOP package. :shock: :? A Type II TSSOP has the legs protruding from the length portion of the package. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight and forty pins. Usually, to put these packages onto a PCB requires an automated procedure involving pick-and-place machines and reflow ovens. If you want to be sure, check the package drawings. All IC assembly processes remain the same as with standard SOPs.

Another SOIC variant, available only for 8-pins and 10-pins ICs, is the mini-SOIC, also called micro-SOIC. (4.9mm vs. 3.0mm) and only a bit wider.

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